High-density wiring is now possible, enhancing design flexibility! Compatible with various specifications.
We would like to introduce our support for high-density build-up structures. High-density wiring has become possible, enhancing design flexibility. With LVH connections, high-speed wiring without via stubs is achievable. We support specifications such as narrow pitch compatibility and high-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching, and improved characteristics for high-frequency applications). 【Supported Specifications】 ■ Narrow pitch compatibility ■ High-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching & improved characteristics) ■ Thick copper foil specifications ■ Mixed IVH & LVH *For more details, please refer to the PDF document or feel free to contact us.
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OKI Circuit Technology Co., Ltd. is a manufacturer engaged in the development, design, and production of printed circuit boards, electronic devices, and substrate mounting of electronic components. With a consistent system from pattern design/simulation to manufacturing, we deliver printed circuit boards with specific functions added for various applications, such as controlled characteristic impedance, heat dissipation measures, build-up, changes in inner layer copper foil thickness for high current, high-frequency compatibility, and noise countermeasures, all within short delivery times. With many years of development and manufacturing experience, we have a strong track record in the fields of aerospace and defense equipment, transportation infrastructure equipment, high-end communication and measurement devices, semiconductor testing equipment, industrial equipment, and medical devices. We respond to a wide variety of outsourcing needs. For any inquiries regarding mounting substrates or printed circuit boards, please feel free to contact us.