Manufacturing is possible from a minimum of 0.5mm to a maximum of 25mm! A complete range of products by gasket size and material is available.
The "SMT EMI Gasket (PCB Ground Pad)" is a product designed to reduce electromagnetic noise generated from within electronic devices and protect circuits from electrical surges. The SMF01 series is manufactured using a method that wraps PU sponge with a conductive metal film. It is very soft, so it exerts almost no stress on the PCB. The SMF02 series is a small SMT EMI gasket composed of a silicone rubber core and a conductive metal surface layer, suitable for small IT devices such as mobile phones. 【Features】 ■ The SMF01 series is suitable for medium to small sizes, while the SMF0 series is suitable for ultra-small sizes. ■ A variety of materials can be selected to match the characteristics of the device. ■ Excellent electrical conductivity (resistance below 0.1Ω) and compression recovery rate (over 90%). ■ A combination of product materials and shapes ensures adhesion and minimizes stress on the PCB. *For more details, please refer to the PDF document or feel free to contact us.
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【Lineup】 ■SMF01 Series ■SMF02 Series ■SMF03 Series *For more details, please refer to the PDF materials or feel free to contact us.
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Our company has been specializing in the production of electromagnetic wave control-related components since its establishment in 1991. Based on our technological competitiveness, we produce a variety of electromagnetic wave shielding and absorption components, thermal conduction components, and supply products to leading electronic communication companies both domestically and internationally. With our specialized technology and production facilities focused on electromagnetic waves and heat dissipation measures, we provide our customers with a stable EMC Total Solution.