Easy implementation of dissimilar material bonding and resin sealing on a tabletop with a compact desktop injection molding machine.
Mold Lock X-801
Strong bonding of metal and resin (about twice that of industrial adhesives) is possible.
Insert molding and other dissimilar material bonding, as well as resin sealing, can be easily performed on a tabletop. By combining various resins, we expand the possibilities for prototyping and manufacturing, contributing to the enhancement of research and development capabilities and technical skills. By bonding different materials, it becomes possible to enhance functionality and reduce costs by utilizing the characteristics of each material. Insert molding of different resins is also possible. With NMT (Nano Molding Technology) and fully melted resin from Mold Lock, we have achieved bonding strength in dissimilar material bonding (insert molding) between resin and metal that is approximately twice that of industrial adhesives, with even higher strength than conventional methods (average of about 45 MPa). (Values based on shear strength evaluation of aluminum alloy (A5052) and PPS according to ISO 19095 evaluation method) For more details, please refer to the catalog and website. Related link - https://www.centinno.co.jp/
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basic information
【Specifications】 ■ Lineup: Three types - X-801UII, X-801SIIA, X-801SIIB ■ Maximum discharge volume (cc): 70 ■ Maximum filling pressure (MPa): 6 ■ Maximum injection rate (cc/sec): 5 ■ Startup time (min): 10 (for up to 350℃) ■ Maximum heater power (W): 800 ■ Maximum plunger power (W): 400 ■ Rated voltage (V): AC100 ■ Maximum continuous operating temperature (℃): 420
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Delivery Time
※Delivery dates may vary depending on the time period, so please inquire.
Applications/Examples of results
It is widely used for creating test specimens using general-purpose resins, high-performance resins, and eco-plastics, as well as for prototyping, small-batch production, resin bonding, and resin sealing. 【Examples of Use】 ■ Thick-walled molding, thin-walled molding, precision molding, low-pressure molding, integration into production lines, lab molding, molding of optical properties and high transparency resins ■ Rapid prototyping and agile development using "3D printer + mold lock" and "3D translator + mold lock" ■ Inline molding automation ■ Insert molding, resin bonding, resin sealing Achieving approximately twice the strength of industrial adhesives in dissimilar material bonding between resin and metal *For more details, please check the brochure and feel free to contact us. *For more information and molding samples, please visit the website of Century Innovation Co., Ltd. under "Use Cases and Solutions" at the related link. https://www.centinno.co.jp/usecase/ *We can also provide individual demos, prototyping, and mold creation tailored to your needs. Please consult with us.
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Company information
We want to revitalize Japan's manufacturing industry through innovative, environmentally friendly manufacturing that is kind to people and the environment. We aim to energize small and medium-sized enterprises that support Japan's manufacturing and revitalize the entire manufacturing sector. Moving forward, we will continue to work on developing further innovative technologies that can be utilized in various applications, and we aspire to contribute to Japan's manufacturing industry. Century Innovation Co., Ltd.
