Thermal Form Gas Gasket (TFG)

Heat-resistant polyurethane foam is applied as the core material! The recovery rate and adhesion strength have also improved, resulting in excellent heat transfer effects.

The "Thermal Form Gasket (TFG)" is a thermal conduction component that transmits heat from a heat source (circuit element) to a heat sink or metal plate in a short time, allowing for wide diffusion of heat and reducing the temperature of the heat source. It uses graphite, which has excellent horizontal thermal conductivity (400W/mk). There are no thickness constraints, which are a disadvantage of silicone pads, allowing for a wide range of applications. 【Features】 - No need for a heat sink for heat dissipation (direct contact with the case or frame for heat dissipation) - Both the surface and sides of the graphite are wrapped in PET film to prevent particles from the graphite from being generated - Excellent elasticity means that excessive pressure does not need to be applied to the PCB, preventing bending - Various sizes and shapes can be manufactured according to application, making it easy to adjust thermal performance and hardness *For more details, please refer to the PDF document or feel free to contact us.

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