Improved heat dissipation by embedding copper coins in the circuit board.
Copper coins are components with excellent thermal conductivity. By embedding copper coins into circuit boards, it has become possible to efficiently dissipate heat generated by electronic components on the circuit board to the outside. This is an extremely effective thermal management solution for 5G communication devices, medical equipment, automotive parts, and more. We can process shapes that meet specific needs, with a machining precision of ±0.01mm. Through strict quality control, we guarantee stable and high product quality.
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basic information
■Material Name: Tough Pitch Copper (Cu purity 99.99% or higher) ■Compatible Sizes I-Coin: Minimum 2mm*2mm*0.3mm, Maximum 100mm*100mm*3.5mm U-Coin: Minimum 5mm*5mm*1.5mm, Maximum 100mm*100mm*3.5mm T-Coin: Minimum 2.5mm*2.5mm*0.5mm, Maximum 100mm*100mm*3.5mm B-Coin: Minimum 2.5mm*2.5mm*0.5mm, Maximum 100mm*100mm*3.5mm For detailed specifications on copper coin processing, visit: http://www.fukue-sangyo.co.jp/mwbhpwp/wp-content/uploads/e76869b3dc22d8de53792f5cbdfc82fa.pdf
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Applications/Examples of results
Used for heat dissipation equipment such as high-frequency substrates and power amplifier substrates.
Company information
Fukuoka Sangyo Co., Ltd. conducts contract processing of machine parts at its two factories in Dongguan and Suzhou, contributing to our customers' manufacturing. We respond to all needs with reliable technology and experience, from the production of precision parts to tools and fixtures. We listen carefully to our customers' requests and deliver high-quality products in a timely manner at low cost.
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