Effective for identifying defects in semiconductors and electronic components, as well as measuring current distribution in new materials!
This document provides a detailed explanation of the "Contract Analysis Service Non-destructive Observation" conducted by Toshiba Nanoanalysis Corporation. It includes numerous examples such as observing current paths within printed circuit board wiring patterns using a magnetic field microscope, and examining the adhesion of wafer bonding using an ultrasonic microscope (reflection method). Please feel free to consult us when needed. [Contents] ■ Magnetic Field Microscope ■ Ultrasonic Microscope (SAM) ■ 3D X-ray Microscope (X-ray CT) ■ Flow of Contract Analysis Services *For more details, please refer to the PDF document or feel free to contact us.
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Our company offers contract analysis services. Since our establishment in August 2002, we have utilized reliable analysis and measurement technologies along with state-of-the-art equipment to provide optimal nano-level microfabrication, analysis, evaluation of reliability, environmental safety chemical analysis, and service solutions for a wide range of markets centered around semiconductors, liquid crystals, metals, and new materials. Please feel free to contact us if you have any requests.