Cushioning material for 12-inch frame shipping cases (for semiconductor inter-process transport)
We have developed cushioning materials for safely transporting frame shipping cases for 12-inch dicing frames between semiconductor processes.
Introduction of "Cushioning Material for 12-Inch Frame Shipping Cases." We have developed cushioning material for safely transporting frame shippers for 12-inch dicing frames between semiconductor processes. Designed using PAOSS (cushioning simulation) technology. Actual drop tests have been confirmed to meet JIS Z0200 Level I! It can be nested, saving space. Please feel free to contact us when you need assistance. 【Specifications (Excerpt)】 ■Material: Santec Foam (Polyethylene) ■Actual Drop Test: Confirmed to meet JIS Z0200 Level I ■Compatible Models: E400-276-101-0615 ■Packaging Specification: 5 sets/PE bag ■Packaging Size: Approximately 540×345×1050H *For more details, please refer to the PDF document or feel free to contact us.
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Detailed information
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The size of the cushioning material assembly will be 540mm x 354mm x 571mmH.
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Packaging: We will deliver 5 sets in a plastic bag. Packaging size: 540mm x 354mm x 1050mm h
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Company information
Our company, as a proposal development-oriented trading firm, absorbs various needs of the semiconductor market and offers a one-stop solution for transportation materials from the front-end to the back-end, covering everything from design to manufacturing to sales. Our distinctive feature lies in our trading capabilities as part of Oji Holdings, combined with our strength in providing optimal packaging specifications that utilize a range of materials from general-purpose to high-performance, along with our in-house production system and collaboration with partner companies for mass production, all offered as a "proposal development type." From cushioning design to suggestions for returnable materials, we believe we can demonstrate our "comprehensive strength" and provide our customers with exactly what they truly seek.