Coating the substrate side with resin! Expected to suppress the occurrence of product defects.
We would like to introduce our "Package Circuit Board Edge Coating System." The system features separate coating heads that move simultaneously along the edges of the circuit board, applying a liquid agent with a uniform film thickness, adjustable to approximately 20 to 40 microns or more. Additionally, we offer a "Coating Device for Smart Glass" that can precisely and uniformly coat areas smaller than 1mm. 【Features of the Package Circuit Board Edge Coating System】 ■ Developed for the purpose of sealing dust on printed circuit boards ■ Coating the sides of the circuit board with resin helps to suppress product defects ■ Film thickness is adjustable to approximately 20 to 40 microns or more *For more details, please refer to the PDF document or feel free to contact us.
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【Coating Device for Smart Glasses - Features】 ■ Maximizes the capabilities of the lenses ■ Precise and uniform coating on parts under 1mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company started with "monozukuri" centered around metal processing, and since the Showa era, we have continued to respond to the needs entrusted to us by our customers, focusing on the manufacturing of aluminum die-cast and cast products used in engines and tractors, applying the technology we have cultivated over many years. In addition, in the first year of the Heisei era, we established our management philosophy as "contributing to society, improving the lives of our employees, and aiming to create a company that provides a sense of purpose," and we are accelerating our challenges into new markets by developing edge coating agents for electronic circuit boards and automatic coating devices.