Suppress the occurrence of minute foreign substances and enhance the strength of the substrate! Two types to choose from: peeling and non-peeling.
We would like to introduce our "Edge Coating Agent for Package Substrates." This product suppresses the generation of glass resin particles and dust from the edges, reducing cracks and tears caused by impacts during substrate handling and transportation. Under drying conditions of approximately 70°C for 1 minute, the liquid applied hardens into a safe, solvent-free, water-soluble emulsion resin based on polyester. 【Features】 - Suppresses the generation of glass resin particles and dust from the edges - Reduces cracks and tears caused by impacts during substrate handling and transportation - Complies with VOC regulations and RoHS directives - The liquid applied hardens under drying conditions of approximately 70°C for 1 minute - Safe, solvent-free, water-soluble emulsion resin based on polyester *For more details, please refer to the related links or feel free to contact us.
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【Other Features】 ■ Demonstrates sufficient resistance even in the nickel gold plating process ■ Prevents unnecessary gold adhesion to unwanted areas ■ Prevents the loss of debris generated from the internal substrate *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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Our company started with "monozukuri" centered around metal processing, and since the Showa era, we have continued to respond to the needs entrusted to us by our customers, focusing on the manufacturing of aluminum die-cast and cast products used in engines and tractors, applying the technology we have cultivated over many years. In addition, in the first year of the Heisei era, we established our management philosophy as "contributing to society, improving the lives of our employees, and aiming to create a company that provides a sense of purpose," and we are accelerating our challenges into new markets by developing edge coating agents for electronic circuit boards and automatic coating devices.
![[Example] Preventing metal migration due to moisture in multilayer printed circuit boards.](https://image.mono.ipros.com/public/product/image/984/2000640006/IPROS21370121225881087240.jpeg?w=280&h=280)
