Semiconductor manufacturing equipment
We are engaged in the casting and processing of parts with a diameter of approximately Φ340 mm and a thickness of 8 mm, used in semiconductor manufacturing equipment.
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basic information
We are engaged in the casting and processing of parts with a diameter of approximately 340 mm and a thickness of 8 mm.
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Company information
Our company has established a comprehensive system from aluminum casting to processing and assembly. We achieve not only cost efficiency but also high precision and productivity. Additionally, the development of casting technology is one of our strengths. We respond to customer needs with vacuum casting of air-cooled cylinders (fin tip thickness 0.8mm) and gravity casting of high-pressure gear pump parts (30.9Mpa).