Realization of high quality and high stability through patented technology.
The "Smart Dip II FXM-1" is an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxide generation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow rate of the generated waves, this method minimizes the occurrence of copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Reduces daily maintenance time ■ Low oxide generation allows for reduced running costs *For more details, please feel free to contact us.
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basic information
【External Dimensions】 1,590(W)×2,580(D)×1,400(H)mm 【Device Weight】 Approximately 1,900kgf 【Work Size】 Pallet dimensions: 380(W)×350(D)mm / Substrate dimensions: 330(W)×250(D)mm 【Solder Bath】 Stainless steel (nitrided) 【Solder Capacity】 270kg 【Preheater】 IR panel heater (4 zones) 【Number of Registered Models】 999 models
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Company information
FA Shinka Technology Co., Ltd. designs, manufactures, and sells automatic soldering equipment and related assembly equipment. Our devices, which pursue stability in quality and ease of use through proprietary patented technology, have become the foundation of manufacturing worldwide, both domestically and internationally.
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