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  6. High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

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last updated:Feb 20, 2024

松和産業 本社
松和産業 本社
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Using high-frequency materials for specific interlayers while employing different materials for other interlayers! Here are some examples of manufacturing processes.

We would like to introduce an example of the manufacturing process for "hybrid structure substrates." Specific interlayers are made of high-frequency materials, while other interlayers use different materials (such as FR-4). Please feel free to contact us when you need assistance. 【Composition Example】 ■ High-frequency material (core material) ■ FR-4 (PP) ■ FR-4 (core material) *For more details, please refer to the PDF document or feel free to contact us.

    Circuit board design and manufacturing
【高周波基板製造加工例】ハイブリッド構造基板1.PNG

High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

【高周波基板製造加工例】ハイブリッド構造基板1.PNG
【高周波基板製造加工例】ハイブリッド構造基板1.PNG
  • Related Link - https://www.showanet.jp/

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Examples of manufacturing and processing of high-frequency substrates

Examples of manufacturing and processing of high-frequency substrates

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松和産業

松和産業 本社

Electronic Components and Semiconductors

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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!

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