Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!
We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.
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【Build-Up Substrate Manufacturing Specifications Example (Excerpt)】 ■ 10-layer 3-4-3 build-up substrate with 0.4mm pitch BGA (filled via/stacked via specifications) - Board thickness: t1.6mm - BGA pad diameter: φ0.3mm - Resist opening: φ0.32mm - Laser hole diameter: φ0.1mm - Stacked vias using filled vias (via-on-via) - Core section 4-layer TH is resin-filled/covered with plating - L5/6 layer clearance φ0.35mm (TH φ0.2mm drill) *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!