Recently, there has been an increasing demand for a certain thickness even outside of automotive applications!
We would like to introduce the "Through-Hole (TH) Thick Plated Board" handled by Matsuwa Sangyo Co., Ltd. The typical copper plating thickness required for Through-Holes (TH) is generally around 15 to 20 μm. However, to enhance reliability, there has been an increasing demand for a certain thickness (TH plating ≧ 25 μm) even for applications outside of automotive use. Please feel free to contact us when you need assistance. 【Manufacturing Specifications Example for Through-Hole (TH) Thick Plated Board】 ■ TH plating thickness: Capable of supporting TH thickness ≧ 25 μm *For more details, please refer to the related links or feel free to contact us.
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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!
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