It is possible to etch the cladding of optical fibers with submicron precision to make them thinner!
We would like to introduce our "etching" process. By reducing only the cladding diameter (outer diameter) of the optical fiber, the fiber pitch can be made available at 0.25mm or less. By etching a thicker fiber, it can be inserted into a typical Φ125μm hole ferrule, for example. Additionally, by combining with core diffusion (TEC fiber) and tapered optical fiber technologies, the flexibility of optical fiber processing is increased. 【Other Optical Fiber Processing】 ■ TEC Fiber (local heating technology) ■ MFD conversion fiber (PMF compatible) ■ Tapering ■ Short pulse laser FBG ■ Connector processing and cable processing ■ NFP/FFP and various measurements *For more details, please refer to the PDF document or feel free to contact us.
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Our company is engaged in the development, manufacturing, and sales of optical fiber-related products. We are also actively involved in contract research and joint research and development. Please feel free to contact us if you have any requests.