It is a paste-like thermal conductive material that has a hardness intermediate between thermal conductive grease and thermal conductive sheets.
It is used to fill the gap between the heating element and the heat sink, efficiently conducting heat from the heating element to the heat sink. 【Features】 ● Silicone-free (does not use silicone-based materials), so low molecular siloxanes do not occur, eliminating issues such as electrical contact failure. ● Excellent adhesion and conformity to uneven surfaces and curved surfaces, providing reliable thermal conductivity performance. ● High viscosity allows for vertical application without dripping. ● Being clay-like, it can adhere more closely to each component compared to conventional thermal conductive sheets. ● No worries about pump-out. ● Electrically insulating. ● Applied using a dispenser. ● Available as a set with thermal conductive paste and dispenser, thermal conductive paste only, or dispenser only.
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basic information
Thermal conductivity: 8.0 W/m·K Viscosity: 430 Pa·s Density: 3 g/cm³ Volume resistivity: > 10^13 Ω·m Operating temperature range: -40°C to 125°C Capacity: 30 ml Insulation properties
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Applications/Examples of results
●Heat management for heating components in electronic and electrical devices. ●Heat management for CPUs and ICs. ●Heat management for power ICs. ●Heat management for power supplies. ●Heat management for all heating elements.
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Company information
Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent