Space-saving, cost-effective replacement of hand soldering processes and improvement in quality is possible.
The "ULTIMA series" is easy to handle and designed for tabletop use. It addresses the shortage of manual soldering workers and quality instability by replacing them with automated soldering equipment. (Method) Flux application (SPZ) → Preheating (PHS) → Soldering (TRZ) *Material handling is done by the operator. Automation of flux application from manual to automated, reduction of flux liquid volume through uniform application, quality improvement, and labor saving are possible. To accommodate increased production, adding a soldering tank (TRZ) allows for easy and cost-effective solutions. *There are many cases where one operator can handle up to the maximum soldering tank capacity (depending on the circuit board). Please feel free to contact us when you need assistance. 【Features】 ■ High-efficiency flux application under optimal conditions ■ Easy numerical management with OP digital flow display ■ Preheating device (PHS) available for reducing soldering time and effective for solder rise ■ A variety of nozzles necessary for soldering can be selected ■ Stable soldering quality, quality improvement, and labor saving are possible *For more details, please refer to the PDF materials or feel free to contact us.
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【Options (Excerpt)】 ■ Program creation system "Freedom" ■ Production log management app ■ Three-light signal tower ■ Presence sensor ■ Safety cover (with open/close interlock sensor) ■ Aluminum frame stand ■ PC for data creation ■ Data creation software (scanner & Gerber data NC generation) ■ Parts library editing app ■ Circuit board detection & mistake prevention function *For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."