Automatically removes BGA with underfill without damaging the substrate and components.
The defects of the BGA on the implementation board with underfill were limited to either discarding the board or work by skilled operators. This device is equipped with a heating system for the target components and a mechanism to destroy the underfill, allowing for automatic removal without damaging the board or components. It enables many previously abandoned reworks, such as for mobile boards, tablets, and laptops, as well as industrial mobile devices.
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basic information
【Specifications】 • Target component types: BGA, CSP, POP, etc. • Control: PC (laptop compatible, sold separately) • Air: 0.45Mpa or higher • Heater: Hot air (200V/1000W) • Size W: 525mm × 460mm × 640mm • Voltage: 200V • Power: 1,100W • Weight: Approximately 40kg
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Applications/Examples of results
The replacement of BGA components on underfilled substrates (such as mobile phones, tablets, laptops, etc.) required skilled workers, but this is a patented device that allows anyone to automatically remove these underfilled BGAs.
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Company information
Denon Corporation develops, manufactures, and sells soldering and desoldering system tools, as well as engages in the development, design, manufacturing, sales, import and export of audio equipment and electronic devices, and the design and construction of facilities. As a global company, Denon has consistently expanded its business activities with an international perspective and has worked to strengthen its sales network overseas. Currently, it has sales bases in the United States, Europe, Asia, Oceania, and Africa. Through a sales and service network that can promptly respond to the needs of the global market, Denon provides high-quality and reliable products.
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