All hole sizes in the mesh are processed to φD±0.5μm! High-precision classification of a wide range of powders is possible.
Our company offers ultra-high precision mesh with "high-precision electroformed sieves/classification meshes" using high-precision lithography and electroforming technology. We can achieve high-precision classification of a wide range of powders, including inorganic particles such as solder powder and metal particles, as well as organic particles like toner and diamond particles. Additionally, our products feature highly precise opening shapes with no variation, a high open area ratio within the mesh, and a minimum opening size of φ1μm. 【Features】 ■ Highly precise opening shapes with no variation ■ High open area ratio within the mesh ■ Minimum opening size of φ1μm ■ Opening shapes that are resistant to clogging ■ Classification of humic powder particles is also possible *For more details, please refer to the PDF document or feel free to contact us.
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【Recommended Mesh Hole Diameter Sizes by Particle Grade】 ■ Solder Balls: 30–800μm ■ Solder Powder: 2–150μm ■ Diamond Particles: 1–100μm ■ Metal Particles: 1μm-1mm ■ Inorganic Particles: 1μm-1mm ■ Organic Particles: 1μm-1mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The ultra-fine processing technology (photoelectroforming) provided by Optonics Precision is utilized in various fields such as precision machinery, electronics, medical devices/bio-related fields, automotive parts, sensor-related areas, display fields, and optical equipment. Moving forward, Optonics Precision aims to devote all its efforts to the development of even more groundbreaking and innovative new technologies, contributing to the advancement of society.