CAD/CAM customizable design software that integrates 2D and 3D.
It supports wiring design for a wide variety of electronic devices with different manufacturing environments and is equipped with features specialized for the design of three-dimensional laminated structures. It achieves high efficiency in all design tasks from conceptual design to manufacturing. The layer configuration and library registration that influence the tool's performance are unlimited, allowing for the creation of unique designs compatible with next-generation electronic devices. In addition to manual operations via a command menu, automation through programming functions enables users to achieve their own time savings and quality improvements. It is equipped with functions to design various electronic devices such as rigid boards, flexible boards, Si interposers, RDL wiring, package design (BGA/CSP/FOWLP/POP/TSV), panel modules (FPD/LCD/PDP/EL), and optical modules.
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basic information
Product Specifications OS: Compliant with Windows environment Menu Display: Switchable between Japanese / English / Chinese / Korean modes Data Accuracy: 1nm Working Area: 2000m Database: Fully open in ASCII SSF (START STACK FORMAT) Dedicated Programming Language: SeF (START EXECUTE FORMAT) Multi-Open Window: Simultaneous launch of multiple data possible Interface: DXF / 274D / 274X / BMP / GDS2 / ODB++ / ANF / XFL / SPD / DSN / AIF / IDF / IGES / STL Product Lineup: STANDARD / SMART / BASIC / VIEW (free)
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CAD design / CAM editing / data conversion / custom system development
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The Heterogeneous Integration Tool is a pioneer in mixed technologies. START is a unique CAD/CAM/3D integration tool in the electronics industry. It allows for easy recognition of connections in 3D stacked circuits for LSI/PKG/Board within a seamless single database, enabling pathfinding and modeling. Due to its adoption in "ASET," it has been utilized in several national projects and research institutions. It has been adopted by "PETRA" and continues to be used by IO Core Co., Ltd. Additionally, it has been employed in quantum computer 3DIC applications (such as 3D stacking of chips). From design to manufacturing design and direct control of manufacturing equipment through custom software, it enables efficient collaboration and centralized data management via a unified database (ASCII public). By leveraging the industry's first dedicated programming language standardly included in the system, it incorporates the exceptional proprietary technologies of predecessors into the system, providing automation for data checking, modeling, drawing creation, and equipment interfaces. It supports "cost and quality" through high yield by enhancing the accuracy and speed of development progress, as well as centralized management and reuse of resources.