38th Electronics Packaging Society Spring Conference Presentation Materials Released

The presentation materials for the 38th Electronics Packaging Society Spring Conference are now available.

The 38th Electronics Packaging Society Spring Conference was held from March 13 (Wednesday) to 15 (Friday), 2024, at the Noda Campus of Tokyo University of Science. At this conference, Mr. Yanagida, the Technical Department Manager of Takaya Corporation's Industrial Equipment Division, gave a presentation on "The Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." The presentation materials from that session have been made available, so please take a look at the related catalog pages below. -------- Content -------- To ensure reliable assembly guarantees for printed circuit boards, electrical testing is essential. However, a single testing method alone does not provide sufficient test coverage. To address this issue, we introduce a hybrid testing system that integrates flying probe testers with JTAG boundary scan testing. By complementing each testing method, we can maximize the test coverage for high-density printed circuit boards, enabling more accurate fault diagnosis.

Circuit Board Inspection Equipment