Use R-5795(N)/R-5680(N)! Introducing our printed circuit boards.
We would like to introduce our multilayer printed circuit board "Beyond 5G." It uses "H-VLP3," which has a glass transition temperature of 220°C/DMA, a dielectric constant (14GHz) of 3.1, and low roughness copper foil. It features high-speed signal transmission, reduced transmission loss, and excellent through-hole reliability. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed signal transmission ■ Reduced transmission loss ■ Excellent through-hole reliability ■ Excellent heat resistance ■ Lead-free solder compatible *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Tg (Glass Transition Temperature): 220℃/DMA ■ Dielectric Constant (14GHz): 3.1 ■ Dielectric Loss Tangent (14GHz): 0.0016 ■ Coefficient of Thermal Expansion Z (α1): 50ppm/℃ ■ Coefficient of Thermal Expansion Z (α2): 270ppm/℃ ■ UL Heat Resistance: 94V-0 ■ Heat Resistance: 288℃ (120 minutes) ■ Peel Strength: 0.7kN/m ■ Low Roughness Copper Foil Used (H-VLP3) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Chino Giken Co., Ltd. is a company primarily engaged in the design, manufacturing, and sales of printed circuit boards. To meet customer requirements, we optimize products through data processing (DRC and MRC) and provide reliable tools for the manufacturing process. Additionally, we offer advanced services such as development support for new products, pattern design, and circuit board assembly. We actively pursue new technologies to consistently capture customer needs and expectations, delivering high value-added products.