Align the mounting surface of components that cannot be reflowed twice! Heavy components will be placed on the back side of the assembly.
We would like to introduce "implementation," which is a key point in our design. Since the temperature behind tall components tends to rise less, we consider the flow direction of reflow when arranging components. If it leads to mass production, we will adjust the pad dimensions, shapes, and mounting pitch to match the specifications of the mass production factory. 【Features】 ■ Align the mounting surface of components that cannot undergo double reflow Heavier components are placed on the back side of the mounting ■ Arrange components considering the flow direction of reflow ■ Match the thermal capacity of the land on both sides of chip components as much as possible ■ Consider the space for soldering iron for hand-placed components *For more details, please feel free to contact us.
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Our company was established in 1977 as a specialized manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network that has strengths in various sales locations and regions. Please feel free to contact us if you have any inquiries.