Interface covering the electronic device manufacturing environment.
You can consolidate device data from different manufacturing processes onto the same sheet. Devices with significantly different unit systems can also be synthesized. You can smoothly import and match different data components (such as polygon patterns, width lines, custom pads, etc.). This can be utilized for collaboration between LSI chips, packages, and boards. ■ You can synthesize heterogeneous device data to check for interference and connections. ⇒ An M-netlist (connection network of the entire synthesized module) can be output. ■ You can design, edit, and inspect on the same data from nano/micron wiring to millimeter/meter range. Additionally, there are the following use cases: ◆ It can also be used as a support tool for wiring patterns in semiconductor systems. ⇒ RDL wiring/TEG evaluation patterns ◆ Input and output of general-purpose mechanical drawings (DXF) is also possible. ◆ Examples of composite module adoption: 3D image sensor module (ASET) Ultra-wide bus memory 3D-SiP (ASET) Optical electronics packaging system technology development (PETRA) *For more details, please refer to the catalog available for download below.
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basic information
Product Specifications OS: Compliant with Windows environment Menu Display: Switchable between Japanese / English / Chinese / Korean modes Data Accuracy: 1nm Working Area: 2000m Database: Fully open in ASCII SSF (START STACK FORMAT) Dedicated Programming Language: SeF (START EXECUTE FORMAT) Multi-Open Window: Simultaneous launch of multiple data possible Interface: DXF / 274D / 274X / BMP / GDS2 / ODB++ / ANF / XFL / SPD / DSN / AIF / IDF / IGES / STL Product Lineup: STANDARD / SMART / BASIC / VIEW (free)
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Applications/Examples of results
CAD design / CAM editing / data conversion / custom system development
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Company information
The Heterogeneous Integration Tool is a pioneer in mixed technologies. START is a unique CAD/CAM/3D integration tool in the electronics industry. It allows for easy recognition of connections in 3D stacked circuits for LSI/PKG/Board within a seamless single database, enabling pathfinding and modeling. Due to its adoption in "ASET," it has been utilized in several national projects and research institutions. It has been adopted by "PETRA" and continues to be used by IO Core Co., Ltd. Additionally, it has been employed in quantum computer 3DIC applications (such as 3D stacking of chips). From design to manufacturing design and direct control of manufacturing equipment through custom software, it enables efficient collaboration and centralized data management via a unified database (ASCII public). By leveraging the industry's first dedicated programming language standardly included in the system, it incorporates the exceptional proprietary technologies of predecessors into the system, providing automation for data checking, modeling, drawing creation, and equipment interfaces. It supports "cost and quality" through high yield by enhancing the accuracy and speed of development progress, as well as centralized management and reuse of resources.
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