Adhesive Machine "Hartec"

Achieving an alignment error of 20 microns! Demonstrating great power in various bonding applications.

"Haltech" adopts the Non-Stress Flat Lamination (NSFL) method, allowing for the lamination of thin films that could not achieve high precision with conventional methods, without applying stress and in a natural state. No bubbles, waves, or curling phenomena occur. The overlap precision between two films is automatically read and controlled to achieve an accuracy of 20 microns. It is suitable for a wide range of applications, from lamination between films to lamination of laminated boards. We also have a track record of proposing, designing, and manufacturing inline automatic machines. [Features] - Lamination in a natural state without applying stress - No bubbles, waves, or curling phenomena occur - Overlap precision between two films is automatically read and controlled for alignment errors - Suitable for a wide range of applications, from lamination between films to lamination of laminated boards *For more details, please refer to the PDF document or feel free to contact us.

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