Equipped with a dedicated programming language that enables the development of customized tools that integrate unique technologies!
The importance of packaging, which is the latter stage of semiconductor manufacturing, is gaining attention. The advanced implementation technology can handle LSI, PKG, and optoelectronics—Co-Packaged Optics—on a single sheet, and the original 'START' from First Co., Ltd. enables seamless open database modeling for "design/edit/reuse design." This marks the dawn of the heterogeneous integration era. Chiplet SOC, multi-chip modules, 3D IC, and optoelectronic fusion CPO design/edit/reuse design/modeling can all be managed on a single database, allowing for unlimited handling of all components to accommodate heterogeneous modules that require many layers. It is equipped with a dedicated programming language that enables the development of customized tools that consolidate unique technologies, achieving unified operations from development design to manufacturing design, coupled analysis modeling, and direct control of manufacturing equipment integration. *For product details, please check the "PDF Download" below.*
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【Product Specifications】 ■OS: Compliant with Windows environment ■Menu Display: Switchable between Japanese/English/Chinese/Korean modes ■Data Accuracy: 1nm ■Working Area: 2000m ■Database: Fully open in ASCII SSF (START STACK FORMAT) ■Dedicated Programming Language: SeF (START EXECUTE FORMAT) ■Multi-Open Window: Simultaneous launch of multiple data possible ■Interface: DXF /274D/274X/BMP/GDS2/ODB++/ANF/XFL/SPD/DSN/AIF/IDF/IGES/STL ■Product Lineup: STANDARD /SMART /BASIC /VIEW (free) *For more details, please download the PDF or feel free to contact us.
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The Heterogeneous Integration Tool is a pioneer in mixed technologies. START is a unique CAD/CAM/3D integration tool in the electronics industry. It allows for easy recognition of connections in 3D stacked circuits for LSI/PKG/Board within a seamless single database, enabling pathfinding and modeling. Due to its adoption in "ASET," it has been utilized in several national projects and research institutions. It has been adopted by "PETRA" and continues to be used by IO Core Co., Ltd. Additionally, it has been employed in quantum computer 3DIC applications (such as 3D stacking of chips). From design to manufacturing design and direct control of manufacturing equipment through custom software, it enables efficient collaboration and centralized data management via a unified database (ASCII public). By leveraging the industry's first dedicated programming language standardly included in the system, it incorporates the exceptional proprietary technologies of predecessors into the system, providing automation for data checking, modeling, drawing creation, and equipment interfaces. It supports "cost and quality" through high yield by enhancing the accuracy and speed of development progress, as well as centralized management and reuse of resources.