Achieving solutions for challenges in the pick-and-place process! Introduction of dedicated die-cut and pickup tools.
We would like to introduce the "DaiColet, Pick & Place Tool" handled by Micro Point Pro Co., Ltd. With high precision and strict specifications, it accommodates special die shapes and other process limitations. It is a tool made from various materials suitable for diverse applications, including plastic, ceramic, metal, and carbide.
Inquire About This Product
basic information
We provide specialized engineering support focused on solving process challenges, with ultra-high quality and rapid response capabilities. 【Features】 ■ A wide range of designs that meet almost all requirements for pick and place ■ Accommodates special die shapes and other process constraints ■ Specialized engineering support focused on solving process challenges ■ High precision and strict specifications ■ Ultra-high quality and rapid response *You can download the English version of the catalog.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■Plastic ■Ceramic ■Metal ■Carbide, etc. *You can download the English version of the catalog.
catalog（3）
Download All Catalogs
Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.
![[Solutions & Market] Aerospace](https://image.mono.ipros.com/public/product/image/db9/2000602607/IPROS40807036132223987499.png?w=280&h=280)
![[Solutions & Market] Home Appliances](https://image.mono.ipros.com/public/product/image/ab6/2000602626/IPROS22204628399570531456.png?w=280&h=280)
