We also offer "Rework Technical Consulting," where we dispatch experienced engineers from our company!
At Higashi Electronic Industry Co., Ltd., we accept rework of various types of mounted components (SMD, IMD), including BGA (Ball Grid Array). By performing BGA reballing, it is possible to reuse components (reinstallation on different boards due to component depletion, failure analysis of individual components, failure analysis and reproducibility confirmation through component swap reinstallation, etc.). We can also handle the removal (live capture) of components other than BGA that you wish to reuse, as well as modifications to the circuit board. 【Supported Patterns】 ■1. New component rework ■2. New component post-installation ■3. Removal (live capture) ■4. Component regeneration/reinstallation ■5. Component regeneration only *For more details, please refer to the related links or feel free to contact us.
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【Types of Solder Paste】 ■SnPb Eutectic Solder Paste ■SnAgCu Solder Paste ■Bi-based Low-Temperature Solder Paste ※Particle Size: Type 4 to Type 6 *For more details, please refer to the related links or feel free to contact us.
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At Higashi Electronic Industry Co., Ltd., we have been dedicated to creating quality products since our founding, engaging in electronic component assembly, soldering, and mass production. Currently, with the expansion into overseas markets, new needs and wants have emerged that were unimaginable within Japan alone. We believe that listening to these demands and responding swiftly will lead to our future growth.
![BGA Rework and Reballing Support [Case Study Introduction]](https://image.mono.ipros.com/public/product/image/e56/2000231261/IPROS13823774384730474381.png?w=280&h=280)
