Countermeasures against edge chipping by applying compressive residual stress! MD treatment to suppress adhesion of the target object *Also compatible with PFAS regulations.
Our company performs "micro-dimple processing" on serrated edges. This process involves projecting fine particles with a diameter of several tens of micrometers onto the surface of the substrate, resulting in plastic deformation that forms micro dimples on the substrate surface. Additionally, this imparts compressive residual stress, improving the fatigue strength and sliding characteristics of the substrate. By further applying an ultra-thin DLC film, we can enhance durability and corrosion resistance without affecting cutting performance. 【Features】 - Improved fatigue strength and sliding characteristics of the substrate - Enhanced durability - Reduced cleaning frequency - Improved cleanability - Suppression of adhesion on the target object *For more details, please download the PDF or feel free to contact us.
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Our company specializes in contract processing of various surface treatments, including "Micro Dimple Treatment (MD Treatment)" aimed at preventing adhesion and improving slip in the fields of food, pharmaceuticals, and cosmetics, as well as handling "Infinity530." The key technology is the surface modification technique "Micro Dimple Treatment (MD Treatment)," which achieves adhesion prevention and improved slip for food powders, viscous foods, and edible liquids by forming diverse surface shapes. We are also capable of complying with PFAS regulations. By continuously evolving and developing this technology, we aim to solve issues such as food loss and decreased productivity (energy loss) safely and securely, thereby contributing to further reduction of environmental impact and the development of society.