Electronic Patent Technology Trend Survey Report on Heat Resistance Reduction Technology for Electronic Devices and Equipment
You can view patent information categorized by the following technical classifications: - Thermal conductive compositions - Thermal conductive sheets - Heat dissipation structures - Applications characterized by thermal conductivity - Applications characterized by heat dissipation
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basic information
WEB version Thermal resistance is a quantification of how difficult it is for heat to transfer, and it can be thought of in a manner similar to electrical resistance. Therefore, if heat transfer is difficult, the thermal resistance is high, and if heat transfer is easy, the thermal resistance is low. Heat is transmitted through conduction and convection, which involve the movement of substances and molecules, as well as through radiation, which involves the movement of electromagnetic waves. In any of these pathways, thermal resistance can be considered, and it is also used as a factor in thermal design. ■ Target Technologies This document investigates patent information related to inventions that feature applications such as thermally conductive composite materials to reduce thermal resistance, thermal conductive sheets to lower contact thermal resistance with substrates, thermal conductive structures that efficiently transmit heat for dissipation, and devices, systems, and mechanisms with characteristics related to thermal conduction and heat dissipation.
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Dynamic Map: [Price] 180,000 yen + tax Patent Guidebook: [Price] 80,000 yen + tax University Patent: [Price] 30,000 yen + tax All companies addressing the target market: [Price] 30,000 yen + tax NEO Report: [Price] 180,000 yen + tax Web preview is available. We will introduce the actual products. Please feel free to consult with us.
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P3
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P2
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