Report on the Trends of Electronic Patented Technologies for Vapor Chambers and Heat Pipes for Electronic Devices
You can view patent information categorized by the following technical classifications: - Structural materials - Vapor chamber structure - Heat pipe structure - Loop heat pipe - Applied technologies
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basic information
WEB version In recent years, there has been a strong demand for the thinning of vapor chambers designed for mobile devices, as well as for improving the mechanical strength of the body to enhance rigidity, and for improving thermal transport capabilities due to increased heat generation from cooling targets. Manufacturers that produce and sell vapor chambers are actively advancing technological development to address these challenges. [Targeted Technologies] The focus is primarily on technologies related to vapor chambers and heat pipes used in electronic devices such as mobile devices. This includes material technologies that constitute vapor chambers and heat pipes, the thinning of vapor chambers, enhancing the rigidity of the body to improve mechanical strength associated with thinning, and improving thermal transport capabilities due to increased heat generation from cooling targets. The technologies are categorized into seven classifications: vapor chamber structures, heat pipe structures, advanced technologies such as loop heat pipes and self-excited vibration heat pipes, application technologies regarding how heat pipes and vapor chambers are utilized within devices, and emerging reference technologies, providing an overview of the entire landscape.
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Dynamic Map: [Price] 180,000 yen + tax Patent Guidebook: [Price] 80,000 yen + tax University Patent: [Price] 30,000 yen + tax All companies addressing key markets: [Price] 30,000 yen + tax NEO Report: [Price] 180,000 yen + tax Web preview is available. We will introduce the actual products. Please feel free to consult with us.
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P3
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P2
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