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  3. Scientific and Physics Equipment
  4. Surface Treatment Equipment
  5. Surface treatment contract service
  6. Electropolishing (surface treatment)

Electropolishing (surface treatment)

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Semiconductor components

last updated:Nov 13, 2024

弘和テック
弘和テック
  • Official site

Consistent high-quality surface treatment through electrochemical polishing.

【5 Strengths】 ■ Skilled in sizes from palm-sized to 2000 ■ Proficient in aluminum high-speed machining and difficult-to-cut materials ■ Expertise in complex shapes and precision parts ■ Skilled in thin-walled shapes that are prone to distortion ■ Capable of handling prototype machining up to 1000 pieces with automated equipment and a 24-hour system *We have processing examples available. For more details, please contact us or visit our website.

    Surface treatment contract service
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Electropolishing (surface treatment)

DSC_0660.jpg
DSC_0660.jpg
  • Related Link - https://www.kouwa-tec.co.jp/semiconductor

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basic information

• In the semiconductor field, there are strict requirements where "not even a hair's breadth of damage is allowed." o Processing of components for wafer transport used in clean rooms o High-precision component processing such as robotic arm parts o Flexible response to special processing such as "hair processing" for chamber parts and "electropolishing" for gas supply components ---------------------------------------------- [Consistent high-quality surface treatment through electropolishing] Customer's challenge Due to different vendors for machining and electropolishing, quality issues may arise, and measures to prevent recurrence may not be consolidated, leading to delays in response. Our solution We carry out integrated production from processing parts that flow high-temperature gas to electropolishing, improving quality, cost, and delivery (QCD) management. This enables efficient and high-quality production, allowing us to respond quickly and reliably to our customers' schedules and quality needs.

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We can flexibly respond to everything from prototype development to repeat mass production, regardless of the industry, so please feel free to consult with us.

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2024SEMICON Japan

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Our company focuses on the manufacturing of high-precision robotic arms specialized in wafer transport. Through advanced technologies cultivated in the aerospace industry and strict quality control, we deliver high-precision products with an accuracy of 5μ to 10μ, achieving a flawless finish without a single scratch. We provide reliable products that our customers can use with confidence. At this exhibition, we will showcase not only wafer transport arms and frames but also the latest developments in our integrated gas supply system for semiconductor manufacturing, which is currently under development, as well as high-precision machined parts essential for seal surface processing. We invite you to witness our technological innovations and high quality. Companies and organizations from the following fields are exhibiting: ■ Advanced semiconductors and future applications AI, machine learning, 5G/6G communication technology, quantum computing, automotive (EV, autonomous driving), VR/metaverse, space, aerial mobility/drones ■ Semiconductor manufacturing equipment Design equipment for semiconductors, mask manufacturing equipment, wafer manufacturing equipment, wafer process equipment, assembly equipment, inspection equipment, and other related equipment ■ Components and materials for semiconductor manufacturing Process materials, test materials, assembly materials, substrates, parts, and subsystems

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弘和テック

弘和テック

Manufacturing and processing contract

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Sixty years since its founding. We have extensive achievements in the aerospace, medical, and semiconductor fields. We have achieved a thickness of 0.1mm in the processing of "thin materials," which are prone to distortion, through our unique jig and cutting tool design. We also handle the processing of "difficult-to-cut materials" such as Inconel and titanium, with experienced craftsmen and certified inspectors ensuring the quality of our products. ● Achievements in "thin material" processing through weight reduction cultivated in the aerospace field - Processing of various parts such as aircraft body components, satellite components, and defense components - Specializing in difficult processing that requires technology through our unique jig and cutting tool design ● In the semiconductor field, there are strict requirements where "even a hairline scratch is unacceptable" - High-precision parts processing such as components for wafer transport - Flexibly responding to special processing such as "Hale processing" and "electrolytic polishing" ● In the medical field, parts that enter the body prioritize "safety and security" - Processing of components for implants and prosthetic limbs - Collaborating with doctors and experts to support technical challenges in the medical field from the prototype development stage ● Prototype development in next-generation fields - Exploring whether the know-how and achievements cultivated in the aerospace field can be applied to new areas. We are actively challenging prototype development for flying cars, hydrogen engines, EVs, and more.

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