Please utilize Takaya's flying probe tester for the inspection of large substrates for medical devices (in conjunction with boundary scan).
By combining visual inspection, non-contact scanning, and physical probing, we meet the stringent reliability standards in the medical device field, achieving both quality improvement and cost reduction. 【Implementation Achievements】 - Achieved full inspection in inline testing, ensuring product quality. - Enhanced defect detection capabilities for large substrates and complex design boards through collaboration with boundary scan technology. 【Challenges Faced by Customers】 Limitations of APT alone: Flying probe testers excel in electrical characteristic testing, but physical access for probing is difficult for components with hidden pin connections, such as BGA and QFP. In high-density substrates, there are areas that cannot be fully covered by probing alone. Constraints of AOI: Cannot detect defects (such as solder bridges or connection failures) located beneath BGA or large components. Internal connections and micro shorts in multilayer substrates cannot be detected. In large substrates, areas beyond the field of view occur, making it difficult to efficiently inspect the entire area. Challenges with large substrates and complex designs: In large substrates, inspection time tends to increase for both AOI and APT, leading to decreased productivity. Full inspection of high-density mounted substrates requires an efficient inspection system that combines physical probing and non-contact inspection.
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**Benefits of Introducing Flying Probe Tester + Boundary Scan Integration** **Collaboration with Boundary Scan Technology:** By incorporating boundary scan technology into the APT inspection flow, it enables non-contact detection of BGA underfill and internal wiring defects that are difficult to detect with AOI or APT. It verifies the connection status between JTAG-compatible devices and detects wiring breaks and shorts with high precision. **Complementing AOI:** APT and boundary scan complement internal wiring and hidden connection defects that are often missed by AOI. Areas of appearance defects detected by AOI are re-verified using APT and boundary scan to prevent false positives and oversights. **Support for Large Boards and High Component Boards:** The combination of APT and boundary scan technology leverages the characteristics of physical probing and non-contact scanning to efficiently cover large boards entirely. It achieves flexible inspection that is not affected by component height or the internal characteristics of multilayer boards. **Cost Reduction and Efficiency:** The collaboration of APT and boundary scan, which does not require fixtures, reduces the costs of fixture production and storage. By dividing the visual inspection performed by AOI and the electrical characteristic inspection conducted by APT/boundary scan, inspection efficiency is improved.
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**Effects of Implementation** High Inspection Coverage: By integrating AOI, APT, and boundary scan, comprehensive inspections can be conducted from appearance to internal wiring. This reduces the chances of missing defects and false reports, thereby improving quality. Flexible Design Support: Supports designs with reduced test points and boards with many BGA components. It can be quickly operated even in low-volume, diverse production or during design changes. Improved Inspection Efficiency: An efficient inspection process is established through screening with AOI, connection verification with boundary scan, and detailed inspection with APT. This shortens inspection time for large and complex design boards. Cost Reduction: By combining jig-less APT and non-contact boundary scan technology, inspection costs are optimized. **Application Examples** Surgical Robot Control Board: Detects appearance defects with AOI, and complements internal connections and electrical characteristics with APT and boundary scan. Diagnostic Device Board: Conducts detailed inspections of defects on large boards by combining AOI and electrical testing. Biological Monitoring Board: Efficiently detects internal wiring defects specific to fine signal lines and multilayer boards.
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![[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"](https://image.mono.ipros.com/public/catalog/image/01/ff3/783618/IPROS14580097868979274668.jpeg?w=120&h=170)
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Founded in 1894 as a textile company, Takaya Textile expanded and established its electronics division in 1966, beginning the assembly of transistor radios. Currently, in addition to contract manufacturing services (EMS) related to electronic devices, the company actively manufactures and sells in-circuit testers (printed circuit board inspection devices), RFID-related equipment (technology that enables information exchange through short-range wireless communication from IC information tags), and engages in IT consulting and system solutions, among various electronics businesses both domestically and internationally. We will continue to evolve as a corporate group that contributes to the development of society, with textiles and electronics as our two pillars.