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  3. Scientific and Physics Equipment
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  5. Plating Equipment
  6. Numerous achievements: Improve secondary mounting capability with solder through electroplating!

Numerous achievements: Improve secondary mounting capability with solder through electroplating!

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last updated:Nov 19, 2024

友電舎 本社、工場
友電舎 本社、工場
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The disadvantages of non-electrolytic plating can be resolved through electrolysis! It can enhance secondary mountability with solder.

At our company, which handles a large amount of electrolytic gold plating, we have established an electrolytic Ni, Au, and Pd plating method to meet customer needs. By converting from electroless Ni (nickel), Pd (palladium), and Au (gold) plating to electrolytic plating, we eliminate the disadvantages of electroless plating. By introducing a Pd plating layer as a barrier layer in between, we can more effectively control the exposure of Ni to the Au surface. Additionally, by incorporating a Pd layer, we can reduce the thickness of the Au plating, which enhances secondary mounting capability with solder. 【Features】 ■ More effectively control the exposure of Ni to the Au surface ■ Enhance secondary mounting capability with solder ■ Electrolytic Ni ・No thickness limitations ・Can accommodate underlying Cu plating for non-magnetic purposes *For more details, please download the PDF or feel free to contact us.

    Plating Equipment
株式会社友電舎.PNG

Numerous achievements: Improve secondary mounting capability with solder through electroplating!

株式会社友電舎.PNG
株式会社友電舎.PNG
  • Related Link - https://www.ydn.co.jp/technology/case-denkai-nipda…

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【Other Features】 ■Electrolytic Pd - Thickness can be adjusted according to specifications - Prevents diffusion of the underlying Ni layer due to heat resistance (barrier layer) ■Electrolytic Au - No thickness limitations - Good wettability and solderability - Suitable for semiconductor components *For more details, please download the PDF or feel free to contact us.

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【Product Examples】 ■ Semiconductor components / Various substrates / Glass hermetic products / Contact components / Composite components, etc. *For more details, please download the PDF or feel free to contact us.

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Electrolytic Ni·Pd·Au plating

Electrolytic Ni·Pd·Au plating

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友電舎

友電舎 本社、工場

Manufacturing and processing contract

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The slogan is "Challenge the Impossible." We are a technology development-oriented company that broadly develops unique surface treatment technologies to meet the special needs required for essential low-voltage components (related to electricity, electronics, and semiconductors), high-voltage components (such as high-voltage connectors), and insulating components. Additionally, we have established a support system that incorporates functional surface treatments, which we have cultivated since our founding, as our core technology, along with processes such as pressing, heat treatment, painting, and assembly. We will continue to deliver consistent Yuden-sha brand technologies and products to the world. *We support online business meetings.

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