We can also accommodate sapphire blocks and Si wafer downsizing!
Our company specializes in "difficult-to-machine materials processing." We have experience in drilling and shaping difficult-to-machine materials such as sapphire, silicon, SiC, quartz, ceramics, laminated glass, and composite materials (glass and metal). Please feel free to contact us when you need our services. 【Processing Achievements】 ■ Sapphire block ■ Blue sapphire ■ Sapphire with φ0.1 holes ■ Si wafer downsizing ■ SiC ■ Alumina *For more details, please refer to the PDF document or feel free to contact us.
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We specialize in drilling holes and precision grinding and polishing of brittle materials such as glass. We believe our role is to collaboratively solve the challenges of customers who are "thinking about new manufacturing" with creativity (i.e., "inspiration" and "execution ability") and contribute to the advancement of humanity. While being mindful of the environment, we will cherish ideas and foster a culture that enjoys challenges to solve more issues.
![[Glass Processing Case] Difficult-to-Cut Material Processing](https://image.mono.ipros.com/public/product/image/439/2000338664/IPROS55697351447615462803.jpeg?w=280&h=280)
![[Processing Reference Example] Casing Screw Machining](https://image.mono.ipros.com/public/product/image/2088546/IPROS16021466541096188662.png?w=280&h=280)
