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  6. Core technology: Copper metal mesh

Core technology: Copper metal mesh

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last updated:Dec 06, 2024

日本マイクロン電子
日本マイクロン電子

Metal mesh is actively used for sizes larger than PC panels!

We would like to introduce our core technology for metal mesh transparent electrodes, "Copper Metal Mesh," which we handle. The surface resistance is <0.1Ω/□, the electrode formation process is etching, the minimum L/S is 5/100μm, the flexibility is R5mm@100k cycles, and there are no issues with ion migration. The touch response speed depends on the capacitance value and the surface resistance of the electrode, so metal mesh is actively adopted for sizes larger than PC panels. 【Specifications】 ■ Surface resistance: <0.1Ω/□ ■ Electrode formation process: Etching ■ Minimum L/S: 5/100μm ■ Flexibility: R5mm@100k cycles ■ Ion migration issues: None *For more details, please download the PDF or feel free to contact us.

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Core technology: Copper metal mesh

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  • Related Link - https://www.micron-japan.com/

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Trends and Future Prospects of Metal Mesh Transparent Electrodes Technology

Trends and Future Prospects of Metal Mesh Transparent Electrodes Technology

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日本マイクロン電子

日本マイクロン電子

Electronic Components and Semiconductors

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Our company, under the principle of "sincerity and trust," contributes to the creation of a richer society that is more human-like. We will introduce excellent technologies and products, develop systems and services, and provide "satisfaction" to our customers through specialized departments that are well-versed in their fields, using efficient and rational methods without waste. Please feel free to contact us when you need our services.

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