I excel at pinpoint heat dissipation.
- Utilizing the thermal conductivity properties of copper, heat from the heating components is directly dissipated to the back side. - Copper pins are inserted only in the areas of the components where heat needs to be dissipated, resulting in weight reduction. - This is a substrate with copper pins inserted into a familiar copper-clad laminate.
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basic information
Item Standard Specification Remarks Substrate FR-4 35 [μm] Supports CEM-3 substrate, halogen-free substrate, and high Tg substrate Board Thickness 1.0, 1.6 [mm] Supports 0.6 to 1.6 [mm] Copper Pin Diameter φ2.5, 5.0, 8.0 [mm] For other pin diameters, please consult separately. Copper Pin Spacing Above board thickness Please indicate the insertion locations for copper pins on the drawing. Copper Pin Shape Circular Square, other shapes, and irregular shapes can be discussed separately. Copper Pin Insertion Process After NC drilling or after copper plating Standard: Copper plating → Copper pin insertion → (Copper plating) → Pattern formation ~ Surface Treatment Specification Water-soluble pre-flux treatment Supports lead-free solder leveling treatment and electroless Ni-Au plating treatment.
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Applications/Examples of results
It is suitable for heat dissipation of IC components and heat-generating parts.
Company information
Shirai Electronic Industry Co., Ltd. is a company that develops printed circuit board business both domestically and internationally. We recognize our customers' challenges at every stage from design and prototyping to mass production, and we provide solutions. Additionally, we handle everything from order data to the completion of circuit boards, offering printing technology VE proposals and multifunctional circuit boards.
