Introducing observations of CNF in PE and the higher-order structure of cell walls in PE foams, along with photos!
On our company website, we introduce examples of resin material observation using transmission electron microscopy (TEM) and scanning electron microscopy (SEM). In the TEM observation examples, we include observations of CNF in PE, the higher-order structure of cell walls in PE foams, and the lamellar structure near the surface of HDPE. Additionally, in the SEM observation examples, we present comparisons before and after weather resistance tests of ABS resin, as well as cross-sectional structural analysis of automotive bumper materials. Please take a look. [Content Included (Partial)] ■ TEM Observation Examples - Observation of CNF in PE - Higher-order structure of cell walls in PE foams - Observation of lamellar structure near the surface of HDPE - Morphology observation examples of HIPS/ABS systems - Morphology observation in PC/ABS system materials *For more details, please refer to the related links or feel free to contact us.
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【Other Published Content】 ■Scanning Electron Microscope (SEM) Observation Examples - Comparison before and after weather resistance testing of ABS resin - Internal structure of HDPE spherulites (lamellar crystals) - Internal structure of LDPE spherulites (lamellar crystals) - Cross-sectional structural analysis of automotive bumper materials *For more details, please refer to the related links or feel free to contact us.
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Ronbic Co., Ltd. is a 100% subsidiary of Mitsubishi Chemical Corporation. The company develops its business primarily in four areas: resin business, resin sales business, analysis business, and business services. In the resin business, we develop and manufacture plastic products using compound resins in a one-stop manner tailored to various applications, delivering to a wide range of markets including automotive, home appliances, medical, packaging, and construction materials. We invite you to try our compound products, which combine technical expertise, responsiveness, and development capabilities.