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  6. High thermal conductivity substrate / aluminum base substrate / copper base substrate

High thermal conductivity substrate / aluminum base substrate / copper base substrate

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last updated:Dec 05, 2024

シライ電子工業
シライ電子工業
  • Official site

We provide metal base substrates that achieve high current and high heat dissipation.

- This is a substrate that can protect components from thermal destruction with high thermal conductivity and heat dissipation characteristics. (Base material nominal heat dissipation characteristic: 3.0 W/m·K or higher) - It offers high tracking resistance, ensuring electrical fire safety. (CTI value: 600 V or higher) - This substrate has high dielectric strength, allowing for safe use. (Through thickness dielectric strength: 3.0 kV / 100 μm) - UL certified.

    Printed Circuit Board
スクリーンショット

High thermal conductivity substrate / aluminum base substrate / copper base substrate

スクリーンショット 2024-12-05 162335.png
スクリーンショット 2024-12-05 162335.png
  • Related Link - https://www.shiraidenshi.co.jp/homepage/product/pr…

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basic information

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Applications/Examples of results

LED lighting, power supplies, computers, automotive LED applications, power equipment. Aluminum base substrates also have excellent dimensional stability. Aluminum has a lower coefficient of thermal expansion compared to standard FR-4 substrates, resulting in minimal expansion and contraction due to heat, and the dimensions of the substrate remain almost unchanged even at high temperatures.

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シライ電子工業

シライ電子工業

Electronic Components and Semiconductors

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Shirai Electronic Industry Co., Ltd. is a company that develops printed circuit board business both domestically and internationally. We recognize our customers' challenges at every stage from design and prototyping to mass production, and we provide solutions. Additionally, we handle everything from order data to the completion of circuit boards, offering printing technology VE proposals and multifunctional circuit boards.

Product/Service List (13)

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Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].
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