Notice of Participation in "Nepcon Japan Electronics Development and Implementation Exhibition"
We plan to exhibit a total of six devices, including selective soldering equipment and a doctor palette!
Koki Tech Co., Ltd. will be exhibiting at the "39th NEPCON Japan Electronics Development and Manufacturing Expo" held at Tokyo Big Sight. We plan to showcase a total of six pieces of equipment, including the "VFR-408N," which reduces flux cleaning, and the innovatively designed "ULTIMA-TRZ." We look forward to your visit. 【Exhibition Overview】 ■ Exhibition: 39th NEPCON Japan Electronics Development and Manufacturing Expo ■ Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 - 17:00 ■ Location: Tokyo Big Sight, East Hall 1 ■ Booth Number: East 1E4-2 ■ Admission Fee: Free (Pre-registration required) *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
【Exhibition Equipment】 ■ All-in-one selective soldering device "NEO-L Smart (with IPH)" ■ Far-infrared combined hot air circulation reflow oven "VFR-408N" ■ Desktop selective soldering device "ULTIMA-TRZ" ■ Desktop selective spray device "ULTIMA-SPZ" ■ Doctor Palette ■ Inline selective soldering device "SELBOIII" *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."