High-aspect-ratio via formation technology using glass resin substrate materials
This is a technology for forming build-up vias used in the production of high-frequency antenna patterns on printed circuit boards. While laser processing is commonly used for build-up vias, high-precision via formation using mechanical drilling and the developed high-aspect-ratio plating layer have enabled the formation of vias with a drill diameter of 0.15 mm and an interlayer distance of 0.6 mm, achieving a high aspect ratio of 4. This has made flexible antenna design for high-frequency antenna patterns possible.
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basic information
Through hole formation: Plate thickness 6.5 mm / Drill diameter 0.15 mm, Aspect ratio (plate thickness ÷ drill diameter) = 43.3 Blind hole formation: Interlayer thickness 0.6 mm / Drill diameter 0.15 mm, Aspect ratio (interlayer thickness ÷ drill diameter) = 4
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Applications/Examples of results
Formation of millimeter-wave high-frequency antenna substrates Expected fields of application: satellites, routers, base station antennas, data centers, millimeter-wave radar, optical transmission devices, semiconductor test boards
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Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
