For semiconductor silicon wafers and the like! Compatible with heat adhesives (such as shellac resin).
"SKB-13" is a plate primarily composed of aluminum hydroxide and unsaturated polyester resin. It has excellent workability and a material composition that suppresses the heat generated during processing. It effectively reduces wire breakage and clogging of cutting tools such as wires, making it suitable for wire saws, inner blades, and outer blades. Additionally, it has been redesigned to address the common issue of warping in general resin plates after heating, resulting in a plate that is less prone to warping even after heating and cooling. 【Features】 ■ Excellent workability ■ Low water absorption ■ Less prone to warping even after heating and cooling ■ Compatible with hot adhesives ■ Reduces wire breakage and clogging of cutting tools *For more details, please download the PDF or feel free to contact us.
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basic information
【Representative Characteristics (Partial)】 ■Density: 1.96 ■Rockwell Hardness: HRM72 ■Bending Strength: 52MPa ■Bending Elastic Modulus: 14.6GPa ■Coefficient of Thermal Expansion: 4.6×10-5 ■Thermal Conductivity: 2.1W/mk *For more details, please download the PDF or feel free to contact us.
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【Examples of Achievements】 ■ Silicon wafers for semiconductors ■ Silicon wafers for solar cells ■ Oxide wafers, etc. *For more details, please download the PDF or feel free to contact us.
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Company information
Our company manufactures and sells resin plates (resin beam plates) used for cutting processes of silicon wafers, oxide wafers, rare earth magnets, and more. We carry out all processes from molding to processing using our uniquely formulated resin molding materials, providing beam plates for cutting processes compatible with diamond wire saws, outer blades, inner blades, and multi-wire saws. We aim to maximize the potential of resin composites made from plastics and fillers to contribute to society.