Let's expand the possibilities of manufacturing with new precision and microfabrication methods!
Monozukuri (Saitama University Research Seed Collection 2025-27 p.59)
Laser slicing, laser 3D fine processing, ultra-precision grinding wheels, CMP principle, power semiconductor substrate materials, natural grinding stones, polishing carbon, bronze mirrors.
As high-performance products are born in accordance with the times, production processing technologies are increasingly required to achieve higher precision, miniaturization, and efficiency, leading to the daily development of new technologies. In this context, free and flexible thinking is essential. In the laboratory, we are challenging areas of processing technology that no one has yet realized. During the development process, even good ideas often fail. This is because there are phenomena that no one knows about yet. By considering failure as the foundation of success and using observation and insight to uncover the causes, new possibilities begin to emerge. In this way, entirely new processing technologies are born. To realize this research style, a research environment is essential, including precise experimental equipment to test one's ideas, evaluation devices that can provide accurate assessments, and colleagues studying specialized fields for discussion. In the laboratory, new technologies are being developed daily through the enhancement of experimental facilities and collaborative research with external partners. For example, we are cutting hard, unprocessable semiconductor materials without generating waste. Additionally, a method has been discovered that allows polishing with a soft resin at a rate 100 times more efficient than conventional methods.
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Junichi Ikedo, Professor Department of Mechanical Science, Graduate School of Science and Technology 【Recent Research Themes】 ● Developing new ultra-flat polishing techniques from ancient bronze mirror polishing techniques as a way of learning from the past ● Development of precision grinding wheels with anisotropy ● Development of a new abrasive processing method using zeolites ● Development of new laser processing methods (color marking, dissimilar material bonding, insulation treatment of conductive resins)
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【Appeal Points to the Industry】 ● Through practical education in new technologies, we cultivate the ability of engineers to tackle challenges in various companies. ● Joint research always leads to the creation of patents. ● We also support the development of young talent aiming for degree acquisition through new technology development. 【Examples of Practical Applications, Use Cases, and Utilization】 ● CMP and CMG (mirror grinding wheels) for semiconductor substrate materials. ● 3D processing technology for various materials (glass, PMMA) using lasers. ● Zero material loss peeling processing of semiconductor substrate materials such as SiC, diamond, and silicon. ● Aspheric lens molding processing utilizing laser peeling. ● High-efficiency polishing method for SiC using abrasive-free buff friction (100 times the efficiency of conventional methods).
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An example of abrasive-free polishing of power semiconductor substrate SiC finished to a mirror surface at 100 times the efficiency of conventional methods.
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The Saitama University Open Innovation Center is a center that functions as a liaison office for industry-academia-government collaboration. It consists of three departments: the Industry-Academia-Government Collaboration Department, the Intellectual Property Department, and the Startup Support Department, each staffed with coordinators well-versed in various fields. The center's activities include solving technical challenges in companies, supporting the implementation of joint research, and conducting technology transfer aimed at introducing and utilizing Saitama University's intellectual property.