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  6. Printed Circuit Board Strength Analysis Software for the Electronics Industry

Printed Circuit Board Strength Analysis Software for the Electronics Industry

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FEMFAT MELCOM software

last updated:Apr 18, 2025

マグナ・インターナショナル・ジャパン マグナパワートレイン・ECS(Engieering Center Steyr)
マグナ・インターナショナル・ジャパン マグナパワートレイン・ECS(Engieering Center Steyr)
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Streamlining the strength analysis of printed circuit boards for power electronics products!

Are you looking to efficiently conduct strength analysis of printed circuit boards (PCBs) used in power electronics products? "FEMFAT MELCOM" is a software package that predicts defects on printed circuit boards incorporated in power electronics products such as inverters through simulation. By forecasting issues like cracks in solder joints due to vibration and thermal loads, and the expansion and cracking of multilayer ceramic capacitors (MLCCs), it contributes to improving the efficiency of product development and enhancing reliability. 【Usage Scenarios】 - Development of power electronics products - Fields such as automotive, aerospace, and industrial equipment - Strength analysis, thermal fatigue analysis, and vibration fatigue analysis of printed circuit boards - Reduction of analysis time, improvement of analysis accuracy, and optimization of design 【Benefits of Implementation】 - Reduction of analysis time: Automation features significantly reduce model creation and analysis time. - Improvement of analysis accuracy: Detailed models and analytical methods yield more accurate analysis results. - Optimization of design: Based on analysis results, improvements and optimizations in design can be made. - Efficiency in product development: Early detection of defects during the design phase contributes to shortening development time.

    Structural Analysis
【電子機器向け】プリント基板強度解析ソフトウェア

Printed Circuit Board Strength Analysis Software for the Electronics Industry

【電子機器向け】プリント基板強度解析ソフトウェア
【電子機器向け】プリント基板強度解析ソフトウェア
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【Features】 - Predicting cracks in solder joints on printed circuit board assemblies (PCBA) due to vibrations from power electronics products. - Predicting cracking in multilayer ceramic capacitors (MLCC) during the process of attaching PCBA to power modules. - Predicting cracks due to thermal fatigue in PCBA under temperature load. - Automating the modeling of PCBA. - Performing vibration fatigue analysis in both time and frequency domains. Our Strengths Magna Powertrain & ECS is a company that provides globally recognized engineering services. Leveraging years of experience and expertise, we offer optimal solutions tailored to our customers' needs.

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Strength analysis software for printed circuit boards 'FEMFAT MELCOM'

Strength analysis software for printed circuit boards 'FEMFAT MELCOM'

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Fatigue Life Prediction Analysis Software "FEMFAT"

Fatigue Life Prediction Analysis Software "FEMFAT"

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マグナ・インターナショナル・ジャパン

マグナ・インターナショナル・ジャパン マグナパワートレイン・ECS(Engieering Center Steyr)

Automobiles and Transportation Equipment

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Magna is a mobility technology company and is part of one of the world's largest automotive suppliers. Magna Powertrain and ECS, one of the Magna Group companies, is globally recognized as an engineering partner for passenger cars, commercial vehicles, specialty vehicles, agricultural vehicles, and transportation vehicles, as well as for new entrants in mobility. We provide vehicle engineering, alternative propulsion systems, application software, and various testing and trial services. We focus on lightweight design, modularization, and green transportation, taking into account vehicle development goals, and leverage our experience and know-how in system development and electrification to offer a full range of solutions. Please feel free to contact us if you have any inquiries.

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