Reproducing vertical transport with horizontal shaking! Achieving a more realistic plating test.
This device enables plating tests under conditions closer to actual equipment. By oscillating laterally, simple plating tests can be conducted under vertical transport conditions. Additionally, by replacing the anode case, both soluble and insoluble options can be examined. Furthermore, conducting plating tests with substrate sizes allows for verification that is closer to actual equipment.
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basic information
Device size: 1,200 × 1,200 × 1,500 [mm] Substrate size: 300 × 300 [mm] Swing stroke amount: ±20 [mm] Liquid volume: approximately 100 [L]
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For research and development purposes
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Company information
Toa Electronics Group is pursuing technology and innovation based on its EMS business and wet process business. In the EMS business, we have established a consistent system from planning and development to assembly and manufacturing, providing electronic device-related services with high noise resistance, reliability, and durability. By handling video and content production as well as sound development in-house, we enhance the added value of our products and create unique appeal. In the wet process equipment business, we offer surface treatment equipment and wet process equipment compatible with thin film substrates. Utilizing our unique transport technology to suppress wrinkles, folds, and waviness in substrates, we flexibly accommodate various transport methods (horizontal, vertical, and hoop). We have a proven track record of supporting a wide range of substrates, including flexible substrates, rigid substrates, package substrates, and wafers. We pursue the reliability of electronic devices and innovation in surface treatment technology to support the next generation of manufacturing -- that is Toa Electronics!
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