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  6. Nerlingless Auto Peeler

Nerlingless Auto Peeler

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KLAP

last updated:Apr 16, 2025

アドテックエンジニアリング
アドテックエンジニアリング
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A new technology currently under patent application enables the automatic peeling of difficult-to-remove films such as dry film solder resist, ABF, and dry film resist!

▶ Compatible with various workpieces - Unlike conventional auto peelers, it can peel off high-adhesion films (such as dry film resist, ABF, dry film solder resist, etc.) that are difficult to automatically peel. - It can also accommodate various shapes of workpieces, including ultra-thin films for semiconductors and electronic components, as well as protective films for acrylic and glass. ▶ Compatible with various films - Interlayer insulating materials (such as ABF) - Dry film solder resist (DFSR) - Polyimide films - Other high-adhesion films ▶ Damage reduction - Being burr-free, it reduces film breakage and damage caused by the film. ▶ Clean peeling - Since it does not use air blow, chip flying and dust generation are minimized, resulting in improved yield rates. ▶ Additional options for detection functions available It is possible to detect film breakage and remaining film using sensors or image processing (optional). By adding detection functions, it can further reduce the occurrence of defects and improve yield rates. *Pre-tests using experimental machines are also available before purchase. Please consult us.

    Printed Circuit Board
ナーリングレスオートピーラー標準.png

Nerlingless Auto Peeler

ナーリングレスオートピーラー標準.png
ナーリングレスオートピーラー標準.png
  • Related Link - https://www.adtec.com/products/detail.html?pdid=10…

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▶Peeling Method Narrowing-less + Special Cutting Tool (Patent Pending) Thanks to Adtech's uniquely developed automatic peeling initiation mechanism, stable peeling is possible without narrowing. ▶Target Substrate Minimum: 400×500mm / Maximum: 510×515mm t=0.15mm to 3.5mm (Minimum substrate thickness: 0.04mm) ▶Tact Time Standard Model: 60s / High-Speed Specification: 35s ▶Device Size Standard Model: L 2,250mm x W 2,500mm x H 2,450mm High-Speed Specification: L 2,250mm x W 3,650mm x H 2,450mm

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This is a device that automatically peels off various protective film materials such as DFR (dry film photoresist), interlayer insulating materials, DFSR (dry film solder resist), and polyimide films in the substrate manufacturing process.

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アドテックエンジニアリング

アドテックエンジニアリング

Industrial Machinery

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Adtech Engineering has been providing various devices necessary for manufacturing processes by utilizing a combination of ultra-precision machining technology and FA (Factory Automation) equipment development technology, along with integrated technologies such as optics, software, alignment, and control/analysis. In recent years, we have strengthened our position as a solution-oriented company, focusing particularly on problem-solving in the exposure process. The electronics-related equipment business is characterized by rapid fluctuations and fast technological advancements. In this dynamic market, we aim to optimize and enhance manufacturing processes by offering innovative technologies and solutions. By connecting and further expanding the technical expertise cultivated in each business with diverse applications, our solutions become increasingly robust and diverse, and through continuous innovation, we will continue to build the future of the digital society together with our customers.

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