From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.
Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.
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basic information
Item | Achievements/Capabilities Number of Layers (Maximum) | 30 layers (sample) / 24 layers (mass production) Board Thickness | Minimum 0.125mm, Maximum 3.2mm Minimum Line/Space | Outer layer: 30μm / 30μm, Inner layer: 40μm / 40μm Minimum Hole Diameter for Laser Drill | 50μm (laser), 150μm (mechanical) Surface Treatment | ENIG, ENEPIG, OSP, Gold plating, Tin, Silver, etc. Build-Up Supported Layers | Up to 14 layers (6+2+6) Aspect Ratio | Maximum 14:1 (through hole) Materials | FR4, BT, Teflon, Low Loss, Metal Base, etc. Special Processing | Embedded Capacitor/Resistor, Back Drilling, Step PCB, SLP compatible
Price range
Delivery Time
Applications/Examples of results
Field | Usage Example | Corresponding Products/Features Memory Module | DDR4/DDR5 RDIMM/UDIMM | Equipped with ECC, 9+9 configuration, high-precision L/S pattern SSD Board | For Controller/NAND Package | SKIP build, compatible with build-up structure 5G Optical Transceiver | 400G to 800G OSFP, COB type | Compatible with Megtron6, POFV, fine L/S (2.4/3.2mil) Automotive | High-reliability impedance/environmental resistance board | ISO/IATF/TS certified boards Industrial Equipment | Server/Measurement Equipment/Power Control | Rigid-flex boards compatible with 10 to 12 layers, high heat-resistant materials Smart Devices | CPU, MCU, Memory Card | Thin 0.13mm, 30μm fine pattern, POP/FC compatible
Line up（6）
| Model number | overview |
|---|---|
| Memory Module Board | DDR4 / DDR5 compatible board (R-DIMM / U-DIMM), VA compatible design, ECC support |
| VA compatible design, ECC support | SKIP blind design, build-up layer configuration support |
| Optical Transceiver Board (COB) | 400G / 800G, using Megtron6 / M6G materials, POFV, Bonding Pad, Controlled Depth Routing support |
| High-Density IC Package Board (ICS PCB) | 2 to 6 layers, thickness of 0.13 to 0.56mm, POP, Embedded Die support, SAP / MSAP process |
| FPC / Rigid-Flex Board | Up to 10 layers, Air-gap / EMI support, multi-layer configuration, industrial / high vibration support / ultra-small via formation technology |
| Automotive / Industrial Board | IATF16949 compliant board, heat-resistant and environmental-resistant, DDR use, back drill, high impedance control board |
catalog（1）
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Company information
Our company has deep expertise in analog semiconductors and can provide world-class semiconductor solutions. By replacing the digital semiconductors you are currently using with our developed analog semiconductors, we can achieve low voltage operation, low power consumption, cost reduction, and shorter delivery times. Additionally, we are capable of developing and manufacturing custom semiconductors tailored to your needs, and we also carry out PCB assembly and OEM manufacturing of finished products.