From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.
Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.
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basic information
Item | Achievements/Capabilities Number of Layers (Maximum) | 30 layers (sample) / 24 layers (mass production) Board Thickness | Minimum 0.125mm, Maximum 3.2mm Minimum Line/Space | Outer layer: 30μm / 30μm, Inner layer: 40μm / 40μm Minimum Hole Diameter for Laser Drill | 50μm (laser), 150μm (mechanical) Surface Treatment | ENIG, ENEPIG, OSP, Gold plating, Tin, Silver, etc. Build-Up Supported Layers | Up to 14 layers (6+2+6) Aspect Ratio | Maximum 14:1 (through hole) Materials | FR4, BT, Teflon, Low Loss, Metal Base, etc. Special Processing | Embedded Capacitor/Resistor, Back Drilling, Step PCB, SLP compatible
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Applications/Examples of results
Field | Usage Example | Corresponding Products/Features Memory Module | DDR4/DDR5 RDIMM/UDIMM | Equipped with ECC, 9+9 configuration, high-precision L/S pattern SSD Board | For Controller/NAND Package | SKIP build, compatible with build-up structure 5G Optical Transceiver | 400G to 800G OSFP, COB type | Compatible with Megtron6, POFV, fine L/S (2.4/3.2mil) Automotive | High-reliability impedance/environmental resistance board | ISO/IATF/TS certified boards Industrial Equipment | Server/Measurement Equipment/Power Control | Rigid-flex boards compatible with 10 to 12 layers, high heat-resistant materials Smart Devices | CPU, MCU, Memory Card | Thin 0.13mm, 30μm fine pattern, POP/FC compatible
Line up(6)
| Model number | overview |
|---|---|
| Memory Module Board | DDR4 / DDR5 compatible board (R-DIMM / U-DIMM), VA compatible design, ECC support |
| VA compatible design, ECC support | SKIP blind design, build-up layer configuration support |
| Optical Transceiver Board (COB) | 400G / 800G, using Megtron6 / M6G materials, POFV, Bonding Pad, Controlled Depth Routing support |
| High-Density IC Package Board (ICS PCB) | 2 to 6 layers, thickness of 0.13 to 0.56mm, POP, Embedded Die support, SAP / MSAP process |
| FPC / Rigid-Flex Board | Up to 10 layers, Air-gap / EMI support, multi-layer configuration, industrial / high vibration support / ultra-small via formation technology |
| Automotive / Industrial Board | IATF16949 compliant board, heat-resistant and environmental-resistant, DDR use, back drill, high impedance control board |
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1. Smart Procurement Leveraging a strong network of suppliers worldwide, we respond to the "I need it now" for parts procurement. Emergency Procurement: Achieving a high procurement rate (approximately 95%) with rapid supply. Tonalism Online: Operating a search and quotation site featuring information on over 2.6 million parts in stock. 2. Authorized Distributor Business We handle a wide range of products from excellent semiconductor and electronic component manufacturers around the world and introduce them to the Japanese market. - Support for small quantities and diverse varieties. - A lineup of various categories including MCU, LED, and MOSFET. - Support for circuit boards and EMS, catering to a wide range of needs. 3. Recruitment Through the semiconductor industry-specialized agent "tonaResource," we provide career support from specialized advisors to job seekers. For companies, we contribute to solving industry-wide human resource challenges by introducing ready-to-work personnel and providing recruitment support. We also offer a support program "tonaResource Mirai" aimed at achieving retention for over three years. 4. OEM / ODM Consistently supporting companies from product planning to production, achieving a high balance of quality, cost, and delivery time.









