We will respond to the prototype evaluation using the tabletop vacuum bonding device.
Tabletop Vacuum Lamination Device
We will respond to the prototype evaluation using the tabletop vacuum bonding device.
Ideal for research and development (elemental technology)! / Desktop Vacuum Lamination Device - The lamination operation is controlled by an electric precision Z-stage. - A micro-adhesive pad holds the glass substrate in a vacuum and adheres it to the lower substrate without bubbles. - The upper stage uses a quartz stage, allowing for observation of the lamination state and UV irradiation in a vacuum. - The upper and lower stages can be modified to a type with a built-in heater that reaches a maximum of 120°C. It can also be used for prototype evaluation of the encapsulation process for perovskite solar cells. #Perovskite #DesktopVacuumLaminatingDevice #Vacuum
Inquire About This Product
basic information
Work size: Maximum 120mm x 120mm Total thickness after lamination: Maximum 7mm Pressure: Maximum 300kgf (3000N) Achievable vacuum level: Below 10Pa Heater temperature: Maximum 150℃ Lamination operation: Automatic under recipe conditions
Price range
Delivery Time
Applications/Examples of results
Introduction video of the demo machine Introduction of the tabletop vacuum laminating device https://youtube.com/shorts/VMTgVHaTMao We tried vacuum laminating anti-vibration adhesive mats. https://youtube.com/shorts/l6EEPd_4-zM UV irradiation can be performed during vacuum lamination. https://youtube.com/shorts/UNu860ZTSBE You can observe how the adhesive spreads during vacuum lamination. https://youtube.com/shorts/De63Lw8B5UQ We observed the defoaming process of the adhesive. https://youtube.com/shorts/YloXBP8QwpQ
Company information
We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.
