A dedicated machine for correcting the warping of substrates aimed at improving quality before the implementation of the substrate.
Features ● Easy and smooth operation through touch panel control. ● Each upper and lower plate of the press can be set to different temperatures individually. ・Heating press: 140℃ to 200℃ × 2 【Setting range】・Air cooling press: 50℃ to 120℃ × 1 ・Water cooling press: 15℃ to 50℃ × 1 ● Temperature data and press time for different substrates can be registered up to 50, allowing for reduced setup time. (Optional)
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Main Specifications ● Board Dimensions min□100mm ~ max□450mm ● Board Thickness t = 0.4 ~ 2.0 ● Board Types Glass epoxy and cesium board ● Correction Time 5 ~ 40 sec / 1p ● Conveying Speed 10 ~ 22m/min ● Heating Press ・Cartridge heater ・PID control by electronic temperature controller ● Water Cooling Press ・Circulation system using industrial water and unit cooler (optional) ・PID control by electronic temperature controller * We do not manufacture or sell cooling water circulation devices (chillers), feeding machines, or receiving machines. ● Power AC 200/220V 3-phase 10KVA ● Air Pressure 0.5MPa ● Machine Dimensions Overall length 4,130mm ✕ Front width 925mm ✕ Height 1,800mm
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A dedicated machine for correcting substrate warping aimed at improving quality before substrate assembly.
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In 1979, we established Tokyo Machine and Tool Co., Ltd. with the aim of selling tools and consumables for drilling machines used in printed circuit board processing to meet customer needs. The precision and density required for product substrates have further advanced, and there is a wide range of peripheral equipment such as exposure devices and inspection instruments. Our company aims to offer a product lineup that can propose solutions for the entire process, from material input to product inspection, not just limited to the drilling process of printed circuit boards. We have also established sales bases in Thailand and Vietnam, aiming for global sales that meet customer needs.

