Achievements in the field of electronic materials: Defoamers and anti-foaming agents for epoxy resins.

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BYK-A 530,BYK-1790,BYK-1788,BYK-P 9920,BYK-077

last updated：Dec 08, 2025

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Effective defoamers and antifoaming agents for epoxy resin.

When a suitable defoamer/antifoam agent is added, it replaces the surfactants oriented at the foam interface, disrupting the stabilization of the foam. This allows small bubbles to coalesce into larger bubbles, which rise to the surface more quickly (according to Stokes' law), and the liquid in the lamella layer is also drained rapidly, removing the surface foam.

Related Link - https://www.byk.com/ja/applications/thermosets

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basic information

★ First recommendation: Highly effective in epoxy resin and has low risk of side effects 【BYK-A 530】 Specific gravity (20°C): 0.81 Refractive index (20°C): 1.448 Solvent: Hydrocarbon mixture Flash point: 95 °C ★ If you do not want to include solvents, consider BYK-1790 or BYK-1788, BYK-P 9920 【BYK-1790】 Density (20 °C): 0.85 g/ml Non-volatile content (10 min, 150 °C): 100% 【BYK-P 9920】 In fiber-reinforced plastics such as CFRP and GFRP, BYK-P 9920 also improves the impregnation of reinforcing fibers. ★ If it is important not to hinder transparency, choose products with lower incompatibility (i.e., higher compatibility) 【BYK-077】 Density (20 °C): 0.89 g/ml Non-volatile content (10 min, 150 °C): 52% Solvent: Alkylbenzene Flash point: 45 °C

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Applications/Examples of results

Thermosetting resin (epoxy resin applications): CFRP (carbon fiber reinforced plastic) as a structural component contributes to weight reduction in automobiles and aircraft, as well as in the field of electronic materials.